THE GREEN INTERCONNECT
0eC’s technology
a new way to transfer data
01 / ACTUAL
Chip-to-Chip data transfer, mainly between memory and CPU, is a major energy consumer; the higher the speed, the higher the energy loss.
02 / NO ENERGY LOSS
Our patented solution presents several major benefits over the current technology.
The major benefit is no energy loss along the path. This means the energy required to transmit information becomes negligible, even at 10Gbps.
The manufacturing process is fully compatible with current semiconductor production techniques and does not increase the production costs.
03 / PROTOTYPE
Experiments performed in a laboratory at the Weizmann Institute of Science demonstrated no energy loss along the path. Subsequently, a chip-to-chip prototype was manufactured in a FAB and measured, demonstrating data transfer between two chips without any practical energy loss.
ABOUT 0eC
OUR STORY
0eC SA is a research and development company founded in 2011 by Frédéric Geissbuhler and Erez Halahmi, whose headquarters are located in Vaumarcus (Switzerland). Its R&D activities in high-tech products were, until 2014, carried out in a laboratory located in Saint-Aubin in the canton of Neuchâtel (Switzerland). This laboratory has been used for all of the major stages of research. It was there that, for the first time, the possibility of guiding electron without the application of an electric or magnetic field was demonstrated. The research was supported by world-renowned scientists and researchers, such as Prof. Ron Naaman from Israel’s Weizmann Institute of Science and Prof. Uri Weizer of Technion, Israel.
OUR VISION
OeC SA brings a completely new and innovative solution for interconnections, which is perfectly in line with the current technological trend of “less is more”. Its objectives lie in a constant search for a reduction in energy consumption in favor of capacity, all while simplifying manufacturing processes.
OUR TECHNOLOGY
The technology invented and developed by 0eC uses technical means of information transport other than the metal which has been used in transistor relays since the birth of interconnection. The introduction of a new technology allows for the elimination (1,000-fold reduction per byte) of the energy required for the transfer of information and a nanoscale scaling of the interconnection system. This new technology is a part of the ongoing and upcoming development of the building of the chips necessary for a many applications.
CONTACT 0eC
INFO
Phone: +41 (0)32-836-36-44
Le Château 3
CH-2028 Vaumarcus Switzerland